Managing heat in data centers: Get high performance gap-filling materials

Data centers have a massive appetite for energy, consuming tens of thousands of kilowatts to keep servers and cooling systems running 24/7. One of the core challenges in data center design is maintaining optimal energy efficiency through thermal management. That’s why effective gap-filling and sealing solutions are essential to improving thermal management and reducing energy costs.

Data centers and their growing energy needs

With the rapid expansion of AI-driven computing, data centers are placing an increasing strain on energy supplies. In 2024, data centers accounted for approximately 3-4% of total power consumption in the U.S., according to McKinsey & Company. By 2030, this demand is projected to rise to 11-12% of the nation’s energy supply as the need for high-performance computing accelerates.

In addition to energy consumption, data centers generate significant amounts of heat. A single facility can produce anywhere from 20 to 50 megawatts (MW) of heat. As energy demands grow, effective heat management will be critical in reducing premature wear and maintaining efficiency, keeping operational costs under control.

Heat management materials: Essential for optimizing data centers

Managing a data center’s heat output at every opportunity can help minimize failures and energy waste. Without proper sealing and insulation of servers and cooling fans, inefficiencies in airflow arise. This creates problems like:

Hot air recirculation, which reduces cooling efficiency and increases energy consumption.
Cold air bypass, where cooled air escapes before effectively cooling equipment.
Increased cooling load, forcing HVAC and CRAC units to work harder.
Higher energy costs due to inefficient cooling and excessive power usage.
Shortened HVAC lifespan and increased maintenance caused by overwork and dust infiltration.
Hardware overheating, leading to server failure, lagging performance, and reduced reliability.
Component degradation and corrosion, as air leaks cause humidity fluctuations.
Unpredictable load distribution, resulting from inefficient cooling strategies.

Learn more about SRP’s data center solutions: Mitigating data center NVH: The best materials for vibration and noise control.

How to manage heat in data centers

To beat the heat in data centers, much depends on the performance of your gap-filling and sealing. You need the right material and a precision fit.

Rogers Corp. offers a range of products designed to prevent air leaks, enhance cooling efficiency and protect sensitive components.
At SRP, our experienced team sources and die-cuts these materials into adhesive-backed precision gaskets and seals to help you achieve optimal cooling performance for your data center.

PORON® Polyurethane Foam for Data Centers

Gap-Filling and Sealing Solutions

PORON® microcellular polyurethane foam is engineered for long-term performance in demanding environments, offering high-temperature resistance, a consistent spring force, and reliable sealing against dust and airflow leaks.

Products:

PORON 40 formulation polyurethane foam
PORON 92 formulation polyurethane foam

Key Features:

UL 94 V-0 rated for fire resistance
Less than 10% compression set, maintaining long-term effectiveness
High-temperature resistance up to 90°C

Explore PORON solutions in our products section.

BISCO® Silicone Foam for Data Centers

Airflow Management and Insulation

BISCO® silicone foams provide durable sealing solutions with exceptional fire resistance and long-term performance, making them ideal for critical data center applications.